The characteristics of equipment
TJ-29US Ultrasonic with spraying SMT stencil cleaning machine
Patent design, close contacting ultrasonic combining with spray cleaning, the stencil is no need to dip into the tank
The stencil moves up and down with a gap 0.5-2 mm between the ultrasonic source with the cleaning agent fl ows by
High pressure air knives blowing the stencil closely during the lift makes the drying time very short
Effi ciently clean fi ne printing pitch and apertures with the solder paste and glue
The cycle time is less than 10 min for the solder paste and 15 min for the glue
PLC control, two modes, simple operation with buttons, safe and reliable, easy maintenance
MPC technology with fi ltration system, low running cost and environment-friendly
Process:
Loading---Spraying clean---US clean---Spraying clean---Air knives cut---Unload