The stencil is immersed in the cleaning tank,the ultrasonic source is from the tank wallEffi ciently clean solder paste and glue for the SMT stencilAutomatic lifting after cleaning, equipped with drying tankStainless steel structure,small footprint External dimensions：1100mm(L)×640mm(W) ×1300mm(H) Cleaning cycle:solder paste，3min;red glue,10min Ultrasonic power :1000W Ultrasonic frequency :40K Dry cycle:8~15min Power：< 2.8KW Volume of tank：55L Work temperature: 30℃～35℃ Voltage/Hz：220V AC/50 Weight：180 kg